收藏本站
XR18W753
REV. 1.0.0
SINGLE CHIP 868MHZ TO 956MHZ RF TRANSCEIVER
N AME
TEST2
P IN
31
T YPE
Digital I
D ESCRIPTION
Factory Test Mode. For normal operation, this pin should be connected
to GND.
A2
A3
CLK_OUT+
CLK_OUT-
MODEM_RESET
VREG_CLK_EN
32
33
34
35
36
37
Digital I
Digital I
Digital O
Digital O
Digital I
Digital I
I2C Address bit-2
I2C Address bit-3. This address line should be connected to GND.
16 MHz LVDS digital clock outputs. Connect pin 35 to ground for
CMOS clock output.
Digital modem reset (active high, level sensitive).
Voltage Regulator and crystal oscillator enable (active high, level sensi-
tive)
AVDD19
XTAL1
38
39
Power I
Analog I
VDD (1.9V ± 0.1V) for crystal oscillator and clock divider.
16MHz crystal input or external clock input. Based on typical PCB stray
capacitance, a 27 pF capacitor to GND is recommended.
XTAL2
40
Analog I
Crystal output, 27 pF capacitor to GND is recommended. If an external
clock is used at XTAL1, this input should be left unconnected.
AGND
DVDD_OUT
DVDD
41
42
43
Ground
Power O
Power I
Ground for crystal oscillator and buffers.
Decoupling pin for digital VDD, 10 nF capacitor to GND recommended.
Digital Power Supply, DVDD = 2.2 - 3.6V. DVDD and AVDD should use
the same power supply. 100nF capacitor to GND recommended.
AVDD
44
Power I
Analog Power Supply, AVDD = 2.2 - 3.6V. DVDD and AVDD should use
the same power supply. 100nF capacitor to GND recommended.
AVDD_OUT
45
Power O
1.9V stabilized analog VDD output. This output should be connected to
all AVDD19 pins. 1uF ceramic capacitor to GND recommended.
AVDD19
AVDD19
AVDD19
PADDLE
46
47
48
49
Power I
Power I
Power I
Ground
Analog VDD (1.9V ± 0.1V) for ADC and DAC.
Analog VDD (1.9V ± 0.1V) for ADC.
Analog VDD (1.9V ± 0.1V) for IF strip, TX mixers and both I/Q dividers.
The center pad on the backside of the 48-QFN package is metallic and
is not electrically connected to anything inside the device. It must be
soldered on to the PCB and may be optionally connected to GND on the
PCB. The thermal pad size on the PCB should be the approximate size
of this center pad and should be solder mask defined. The solder mask
opening should be at least 0.0025" inwards from the edge of the PCB
thermal pad.
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
5
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
XS-B14-CB2RB SENSOR TEMP/HUM/LIGHT BATT XBEE
XT09-4II-RA-NA MODEM RF 900MHZ RS232/485 NEMA 4
XT09-DK-MESH KIT DEV 900MHZ W/MESH
XT09-MI MODULE RF 900MHZ 1W 115K W/MMCX
XT09-PKI-EA-NA MODEM RF 900MHZ 1W ETHER INT
XT09-SI MODULE RF 900MHZ 1W 115K W/RPSMA
XU-A11 X-STICK 2.4GHZ USB TO XBEE
XV-8000CB :3 50.3000KHZ+/-60DPS AUTOMOTIVE GYRO SENSOR +/-60DPS
相关代理商/技术参数
XR18W753L48-0A-EB 功能描述:界面开发工具 900MHz RF EVAL Board RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V
XR1901SN 制造商:Electro-Term/Hollingsworth 功能描述: 制造商:Electro-Term/Hollingsworth 功能描述:16-14awg No. 6 stud ring terminal - FAC STK
XR1902SN 制造商:HOLLINGSWORTH 功能描述:16-14awg No. 8 stud ring terminal - FAC STK
XR1903SN 制造商:HOLLINGSWORTH 功能描述:16-14awg No. 10 stud ring terminal - FAC STK - 1k in house
XR1906SN 制造商:HOLLINGSWORTH 功能描述:16-14awg 1/4 stud ring terminal - FAC STK
XR1906SNT 制造商:Electro-Term/Hollingsworth 功能描述:
XR1907S 制造商:Electro-Term/Hollingsworth 功能描述:
XR1907SN 制造商:HOLLINGSWORTH 功能描述:16-14awg 5/16 stud ring terminal - FAC STK